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Nettet16. mar. 2024 · Hybrid bonding binds copper pads at the top of a chip’s interconnect stack directly to the copper pads on a different chip. In hybrid bonding, the pads are in small recesses, surrounded by oxide insulator. The insulator is chemically activated and instantly bonds when pressed to its opposite at room temperature. NettetIntel ® B660 GAMING Motherboard with 6+2+1 Phases Hybrid Digital VRM with MOS Heatsink, 2 x PCIe 4.0 M.2, 2.5GbE LAN, 802.11ac Wireless , Rear USB 3.2 Gen 1 Type-C ®, RGB FUSION 2.0, Q-Flash Plus Supports 13th/12th Gen Intel® Core™ Series Processors Dual Channel Non-ECC Unbuffered DDR4, 2 DIMMs 6+2+1 Phases … synonym for handle or take care of
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